Integrated Subassemblies for Miniaturizing Optical Transceivers
Small coherent optical transceivers have been demanded to provide a high data rate density in next-generation metro area networks and data-center interconnects. Therefore, the mechanical sizes of optical modules and sub-assemblies have been shrinking, and accordingly, highly integrated optical modules have been demanded. Specifically, Miniaturization and integration are always the trends.
image from the internet
HYC has always attach great importance to independent innovation and R&D, recruit a high-quality, strong-ability technology R&D team. We have two R&D centers located in Shenzhen and Wuhan, focusing on the construction of the core technology platforms which are:
1. Optical design, simulation and ray tracing capability;
1. Optical design, simulation and ray tracing capability;
2. High density parallel optics design/manufacturing capabilities;
3. Free space optics design, sub-micron alignment / coupling/assembly capabilities;
4. High precision mechanical design, Precise mold design and mold injection technology
5. Substrate/wafer back-end processing capabilities, and optical glass surface geometry & finite element analysis capabilities
6. Automatic precision assembly/testing capabilities, and software programming
3. Free space optics design, sub-micron alignment / coupling/assembly capabilities;
4. High precision mechanical design, Precise mold design and mold injection technology
5. Substrate/wafer back-end processing capabilities, and optical glass surface geometry & finite element analysis capabilities
6. Automatic precision assembly/testing capabilities, and software programming
We emphasize the capacity building of Integrated Product Development (IPD) based on the six core technology platforms and combined with the market demand, and constantly brings forth new ideas with a richer product line in the future. For more info, please visit www.hyc-system.com

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